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VERSION:2.0
PRODID:-//HPCwire Japan - ECPv4.9.6//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-WR-CALNAME:HPCwire Japan
X-ORIGINAL-URL:https://www.hpcwire.jp
X-WR-CALDESC:HPCwire Japan のイベント
BEGIN:VTIMEZONE
TZID:"Asia/Tokyo"
BEGIN:STANDARD
TZOFFSETFROM:+0900
TZOFFSETTO:+0900
TZNAME:JST
DTSTART:20200101T000000
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20200415
DTEND;VALUE=DATE:20200418
DTSTAMP:20260518T113022
CREATED:20191218T072247Z
LAST-MODIFIED:20191218T072247Z
UID:28491-1586908800-1587167999@www.hpcwire.jp
SUMMARY:IEEE Symposium on Low-Power and High-Speed Chips and Systems (COOL Chips 23)
DESCRIPTION:
URL:https://www.hpcwire.jp/event/ieee-symposium-on-low-power-and-high-speed-chips-and-systems-cool-chips-23
LOCATION:日立馬場記念ホール\, 国分寺市\, 東京都\, Japan
CATEGORIES:国内会議,国際会議
END:VEVENT
END:VCALENDAR